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TM 55-4920-383-13&P
Table 4-4. Troubleshooting Chart - Continued
Malfunction
12. -Continued
Probable cause
b. Defective integrated
circuits A1Z1 through
A1Z5.
Corrective action
b. Check and replace
digital board A1 as
required (see figure
2-12) .
Section III. REPAIR PROCEDURES
4-6.
Scope.
This section contains instructions for authorized repair of the Test Set and replacement
of defective components at direct and general support levels of maintenance. These instruc-
tions include removal and disassembly, cleaning, detail repair instructions, lubrication, and
testing.
4-7.
Removal and Disassembly.
Disassembly of the entire Test Set is not recommended; disassemble the Test Set only to
the extent required to replace defective components. The following procedures are keyed to
figures 3-3 and 3-4.
a. Test Set Disassembly. To disassemble the Test Set, refer to figure 3-3, and proceed
as follows:
(1) Release two latches and remove cover from combination case (33, figure 3-3).
4-20
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